? semiconductor components industries, llc, 2016 october, 2016 ? rev. 9 1 publication order number: murs230t3/d murs230t3g, nrvus230t3g, murs240t3g, nrvus240t3g surface mount ultrafast power rectifiers ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. features ? small compact surface mountable package with j?bend leads ? rectangular package for automated handling ? high temperature glass passivated junction ? low forward voltage drop (0.95 volts max @ 2.0 a, t j = 150 c) ? nrvus and surs8 prefixes for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free and are rohs compliant mechanical characteristics: ? case: epoxy, molded ? weight: 95 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? polarity: polarity band indicates cathode lead ? esd rating: ? human body model = 3a (> 4 kv) ? machine model = c (> 400 v) ultrafast rectifiers 2 amperes, 300?400 volts device package shipping ? ordering information murs240t3g smb (pb?free) 2,500 / tape & reel murs230t3g smb (pb?free) 2,500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. www. onsemi.com smb case 403a a = assembly location y = year ww = work week u2x = device code x = f for murs230t3 = g for murs240t3 = pb?free package ayww u2x (note: microdot may be in either location) marking diagram nrvus230t3g,- NRVUS230VT3G smb (pb?free) 2,500 / tape & reel nrvus240t3g, nrvus240vt3g smb (pb?free) 2,500 / tape & reel
murs230t3g, nrvus230t3g, murs240t3g, nrvus240t3g www. onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage murs230t3g/nrvus230t3g murs240t3g/nrvus240t3g v rrm v rwm v r 300 400 v average rectified forward current @ t l = 150 c @ t l = 125 c i f(av) 1.0 2.0 a non?repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 35 a operating junction temperature range t j ?65 to +175 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. thermal characteristics rating symbol max unit thermal resistance, junction?to?lead (t l = 25 c) r jl 13 c/w electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (note 1) (i f = 2.0 a, t j = 25 c) (i f = 2.0 a, t j = 150 c) v f 1.30 1.05 v maximum instantaneous reverse current (note 1) (rated dc voltage, t j = 25 c) (rated dc voltage, t j = 150 c) i r 5.0 150 a maximum reverse recovery time (i f = 1.0 a, di/dt = 50 a/ s) (i f = 0.5 a, i r = 1.0 a, i r to 0.25 a) t rr 65 50 ns maximum forward recovery time (i f = 1.0 a, di/dt = 100 a/ s, rec. to 1.0 v) t fr 50 ns product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 1. pulse test: pulse width = 300 s, duty cycle 2.0%.
murs230t3g, nrvus230t3g, murs240t3g, nrvus240t3g www. onsemi.com 3 v f, instantaneous voltage (volts) 0.3 3.0 0.01 0.03 0.02 0.2 0.1 10 2.0 0.7 0.7 0.3 0.05 0.5 5.0 , instantaneous forward current (amps) f 0.9 1.3 0.5 0.07 1.0 7.0 1.1 100 c t c = 25 c 175 c i 1.5 1.7 1.9 v f, instantaneous voltage (volts) 0.3 3.0 0.01 0.03 0.02 0.2 0.1 10 2.0 0.7 0.7 0.3 0.05 0.5 5.0 0.9 1.3 0.5 0.07 1.0 7.0 1.1 100 c t c = 25 c 175 c 1.5 1.7 1.9 2.3 2.1 figure 1. typical forward voltage figure 2. maximum forward voltage , instantaneous forward current (amps) f i v r , reverse voltage (volts) 0 150 300 100 100 0.001 1 10 t j = 175 c 50 200 0.1 t j = 100 c t j = 25 c 0.01 250 350 400 * the curves shown are typical for the highest voltage device in the voltage grouping. typical reverse current for lower voltage selections can be estim- ated from these same curves if applied v r is sufficiently below rated v r . figure 3. typical reverse current* figure 4. maximum reverse current for murs230t3g, nrvus230t3g i r , reverse current ( a) t j = 150 c v r , reverse voltage (volts) 0 150 300 100 100 1000 1 10 t j = 175 c 50 200 0.1 t j = 100 c t j = 25 c 250 i r , reverse current ( a) t j = 150 c
murs230t3g, nrvus230t3g, murs240t3g, nrvus240t3g www. onsemi.com 4 v r , reverse voltage (volts) 0 150 300 100 100 1000 1 10 t j = 175 c 50 200 0.1 t j = 100 c t j = 25 c 250 350 400 i r , reverse current ( a) t j = 150 c figure 5. maximum reverse current for murs240t3g, nrvus240t3g t c , case temperature ( c) 80 90 1 2 3 4 5 i f(av) 0 6 7 8 9 10 100 110 120 130 140 150 160 180 v r , reverse voltage (volts) 012 8.0 0 5 10 15 c, capacitance (pf) 4.0 40 0 0.5 1 2 3 4 5 0 1.0 1.5 2.0 2.5 i f(av) , average forward current (amps) p f(av) 24 20 16 36 32 28 20 note: typical capacitance at 0 v = 26 pf rated voltage applied r jl = 13 c/w t j = 175 c , average power dissipation (watts) square wave dc , average forward current (amps) t j = 175 c dc square wave 170 25 30 v r , reverse voltage (volts) 012 8 0 5 10 15 c, capacitance (pf) 440 24 20 16 36 32 28 20 note: maximum capacitance at 0 v = 30 pf 25 30 35 figure 6. typical capacitance figure 7. maximum capacitance figure 8. current derating, case figure 9. power dissipation
murs230t3g, nrvus230t3g, murs240t3g, nrvus240t3g www. onsemi.com 5 package dimensions smb case 403a?03 issue j e b d c l1 l a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension b shall be measured within dimension l1. 2.261 0.089 2.743 0.108 2.159 0.085 mm inches scale 8:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max min millimeters 1.95 2.30 2.47 0.077 inches a1 0.05 0.10 0.20 0.002 b 1.96 2.03 2.20 0.077 c 0.15 0.23 0.31 0.006 d 3.30 3.56 3.95 0.130 e 4.06 4.32 4.60 0.160 l 0.76 1.02 1.60 0.030 0.091 0.097 0.004 0.008 0.080 0.087 0.009 0.012 0.140 0.156 0.170 0.181 0.040 0.063 nom max 5.21 5.44 5.60 0.205 0.214 0.220 h e 0.51 ref 0.020 ref d l1 h e polarity indicator optional as needed on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 murs230t3/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
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